Tenstorrent Opens 40+ PAID AI, Chip Design & Software Engineering Internships Across USA, Canada & Europe

Tenstorrent University has announced 40+ paid internship and PEY opportunities across AI architecture, CPU/SoC design, machine learning, hardware security, compilers, distributed systems, and software engineering. Openings are available in Boston, Austin, Santa Clara, Toronto, Ottawa, Fort Collins, and Belgrade (Serbia), with roles spanning AI hardware, ML systems, chip design, and infrastructure software.

Jan 6, 2026 - 03:52
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Tenstorrent Opens 40+ PAID AI, Chip Design & Software Engineering Internships Across USA, Canada & Europe
Tenstorrent Opens 40+ PAID AI, Chip Design & Software Engineering Internships Across USA, Canada & Europe
Tenstorrent Opens 40+ PAID AI, Chip Design & Software Engineering Internships Across USA, Canada & Europe

Tenstorrent University has announced 40+ paid internship and PEY opportunities across AI architecture, CPU/SoC design, machine learning, hardware security, compilers, distributed systems, and software engineering. Openings are available in Boston, Austin, Santa Clara, Toronto, Ottawa, Fort Collins, and Belgrade (Serbia), with roles spanning AI hardware, ML systems, chip design, and infrastructure software.

AVAILABLE JOB POSITIONS

AI Architecture Intern - PEY (Boston, MA or Toronto, ON), Boston, Massachusetts, United States

AI Hardware Architecture Intern, Austin, Texas, United States; Boston, Massachusetts, United States

AI Hardware Digital Design Engineer Intern (PEY), Toronto, Ontario, Canada

AI Processor IP Product Engineer Intern, Toronto, Ontario, Canada

AI SoC Design Verification PEY, Ottawa, Ontario, Canada

Chiplet Security Research Intern, Santa Clara, California, United States

Chiplet Security Research Intern, Santa Clara, California, United States

CPU Architecture Intern, North America

CPU Core Performance Verification Intern - CPU/AI Hardware, Austin, Texas, United States

Data Engineering Intern, Toronto, Ontario, Canada

Design for Test Engineer Intern - CPU/AI Hardware, Austin, Texas, United States

Design Verification Intern -RISCV CPU, Austin, Texas, United States

Design Verification Software Intern, North America

Intellectual Property (IP) Product Management Intern, Canada; North America

Intern, Scaleout Software (Distributed Systems & Infrastructure), Toronto, Ontario, Canada

Intern, Scaleout Software (Distributed Systems & Infrastructure), Santa Clara, California, United States

Intern, Scaleout Software (Fabric), Toronto, Ontario, Canada

Intern, Scaleout Software (Fabric), Santa Clara, California, United States

Intern Software Engineer – Foundation SW Engineering, Belgrade, Serbia

Machine Learning Engineer Intern (PEY), Toronto, Ontario, Canada

Machine Learning for Physical Design Intern - CPU/AI Hardware, Austin, Texas, United States

Machine Learning for Physical Design Intern - CPU/AI Hardware, Santa Clara, California, United States

Machine Learning Intern, AI Compiler - Model Training (Serbia), Belgrade, Serbia

ML Application & Benchmarking Intern - PEY, Toronto, Ontario, Canada

ML Models Implementation & Performance Optimization - Intern (Serbia), Belgrade, Serbia

Physical Design Intern - CPU/AI Hardware, Austin, Texas, United States; Santa Clara, California, United States

Product Engineer Intern, Toronto, Ontario, Canada

SoC Digital Design Engineer Intern (PEY), Toronto, Ontario, Canada

Software Engineering, Metal Runtime Intern/PEY, Toronto, Ontario, Canada

Software Engineer Intern, AI Compiler, Belgrade, Serbia

Software Intern - AI Compilers, Santa Clara, California, United States

Software Intern - AI Compilers, Austin, Texas, United States

Systems Engineer Intern (PEY), Toronto, Ontario, Canada

Technical Program Management Intern, Austin, Texas, United States; Fort Collins, Colorado, United States; Santa Clara, California, United States; Toronto, Ontario, Canada

Applicants should review role type (Intern/PEY), location eligibility, and technical focus area before applying, as responsibilities and requirements vary across AI, hardware, and software teams.

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